Semiconductor structure and manufacturing method thereof

ABSTRACT

A method of manufacturing a semiconductor structure forming a redistribution layer (RDL); forming a conductive pad over the RDL; performing a first electrical test through the conductive pad; bonding a first die over the RDL by a connector; disposing a first underfill material to surround the connector; performing a second electrical test through the conductive pad; disposing a second die over the first die and the conductive pad; and disposing a second underfill material to surround the second die, wherein the conductive pad is at least partially in contact with the second underfill material, and is protruded from the RDL during the first electrical test and the second electrical test.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional application of U.S. Non-Provisional application Ser. No. 15/725,766 filed on Oct. 5, 2017 entitled “Semiconductor Structure and Manufacturing Method Thereof,” which is hereby incorporated herein by reference.

BACKGROUND

Electronic equipments using semiconductor devices are essential for many modern applications. With the advancement of electronic technology, the semiconductor devices are becoming increasingly smaller in size while having greater functionality and greater amounts of integrated circuitry. Due to the miniaturized scale of the semiconductor device, a wafer level packaging (WLP) is widely used for its low cost and relatively simple manufacturing operations. During the WLP operation, a number of semiconductor components are assembled on the semiconductor device. Furthermore, numerous manufacturing operations are implemented within such a small semiconductor device.

However, the manufacturing operations of the semiconductor device involve many steps and operations on such a small and thin semiconductor device. The manufacturing of the semiconductor device in a miniaturized scale becomes more complicated. An increase in a complexity of manufacturing the semiconductor device may cause deficiencies such as poor electrical interconnection, delamination of components, or other issues, resulting in a high yield loss of the semiconductor device. As such, there are many challenges for modifying a structure of the semiconductor devices and improving the manufacturing operations.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 2 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 3 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 4 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIGS. 5-8 are schematic cross sectional views of conductive members in various arrangements.

FIG. 9 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.

FIGS. 9A-9J are schematic views of manufacturing a semiconductor structure by a method of FIG. 9 in accordance with some embodiments of the present disclosure.

FIG. 10 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.

FIGS. 10A-10H are schematic views of manufacturing a semiconductor structure by a method of FIG. 10 in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Other features and processes may also be included. For example, testing structures may be included to aid in the verification testing of the 3D packaging or 3DIC devices. The testing structures may include, for example, test pads formed in a redistribution layer or on a substrate that allows the testing of the 3D packaging or 3DIC, the use of probes and/or probe cards, and the like. The verification testing may be performed on intermediate structures as well as the final structure. Additionally, the structures and methods disclosed herein may be used in conjunction with testing methodologies that incorporate intermediate verification of known good dies to increase the yield and decrease costs.

A die is fabricated and singulated from a semiconductive wafer. After singulation, the die is packaged to become a semiconductor package and integrated with another die or package. The die is encapsulated by a molding, and I/O terminals of the die are routed out through conductive lines disposed within a dielectric layer, and the die is electrically connected to another dies or packages by a via extending through the molding or a connector between the dies or packages. However, such configuration may not be feasible for identifying failure of dies or electrical interconnections at an earlier manufacturing stage or before completion of the manufacturing. For example, an electrical testing can only be performed when the package is completed.

In the present disclosure, a semiconductor structure is disclosed. The semiconductor structure includes a dummy conductive member for electrical testing during the manufacturing of the semiconductor structure. The dummy conductive member is formed during the manufacturing, and a die or an electrical interconnection in the semiconductor structure can be tested through the dummy conductive member during the manufacturing or before the completion of the semiconductor structure. As such, failure of die or electrical interconnection can be identified at an earlier manufacturing stage. Therefore, wastage of material can be minimized and a yield of the semiconductor structure can be increased or improved.

FIG. 1 is a schematic cross sectional view of a semiconductor structure 100 in accordance with various embodiments of the present disclosure. In some embodiments, the semiconductor structure 100 includes a redistribution layer (RDL) 101, a molding 102, conductive members 103, a first die 104, a second die 105, an second underfill material 106 and a conductive bump 107.

In some embodiments, the semiconductor structure 100 is a semiconductor package. In some embodiments, the semiconductor structure 100 is an integrated fan out (InFO) package, where I/O terminals of the first die 104 or the second die 105 are fanned out and redistributed over a surface of the first die 104 or the second die 105 in a greater area. In some embodiments, the semiconductor structure 100 is a package on package (PoP), that dies or packages are stacked over each other.

In some embodiments, the RDL 101 re-routes a path from the first die 104 or the second die 105 so as to redistribute I/O terminals of the first die 104 or the second die 105 over the molding 102. In some embodiments, the RDL 101 is a post passivation interconnection (PPI). In some embodiments, the RDL 101 includes a first side 101 b and a second side 101 c opposite to the first side 101 b. In some embodiments, the RDL 101 includes one or more dielectric layers 101 a and one or more conductive traces (101 d and 101 e) disposed within and surrounded by the dielectric layer(s) 101 a.

In some embodiments, the dielectric layer 101 a includes dielectric material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, polymer, polybenzoxazole (PBO), polyimide, benzocyclobutene (BCB), or the like. In some embodiments, the conductive traces (101 d and 101 e) includes conductive material such as gold, silver, copper, nickel, tungsten, aluminum, palladium and/or alloys thereof.

In some embodiments, the conductive trace includes a land portion 101 d and a via portion 101 e disposed within the dielectric layer 101 a. In some embodiments, the land portion 101 d is laterally extended in the dielectric layer 101 a. In some embodiments, the land portion 101 d is electrically coupled with the via portion 101 e. In some embodiments, the land portion 101 d is disposed over the second side 101 c of the dielectric layer 101. In some embodiments, the land portion 101 d is configured to receive or couple with external conductive structure. In some embodiments, the via portion 101 e is protruded from the land portion 101 d. In some embodiments, the via portion 101 e is vertically extended between the first side 101 b and the second side 101 c of the dielectric layer 101 a. In some embodiments, the via portion 101 e is disposed or extended between two of the land portions 101 d.

In some embodiments, the molding 102 is disposed over the RDL 101. In some embodiments, the molding 102 is disposed over the dielectric layer 101 a. In some embodiments, the molding 102 is disposed over the first side 101 b of the dielectric layer 101 a. In some embodiments, the molding 102 is in contact with the dielectric layer 101 a. In some embodiments, the molding 102 can be a single layer film or a composite stack. In some embodiments, the molding 102 includes various materials, such as molding compound, molding underfill, epoxy, resin, or the like. In some embodiments, the molding 102 has a high thermal conductivity, a low moisture absorption rate and a high flexural strength.

In some embodiments, conductive members (103 a, 103 b or 103 c) are disposed over or surrounded by the dielectric layer 101 a. In some embodiments, In some embodiments, the conductive members (103 a, 103 b or 103 c) includes conductive material such as gold, silver, copper, nickel, tungsten, aluminum, palladium and/or alloys thereof. In some embodiments, the conductive members (103 a, 103 b or 103 c) are electrically connected to the conductive traces (101 d and 101 e). In some embodiments, each of the conductive members (103 a, 103 b or 103 c) can be in different configurations or shapes such as a pillar, a post, a bond pad, etc.

In some embodiments, the conductive members (103 a, 103 b or 103 c) includes a first conductive member 103 a, a second conductive member 103 b and a third conductive member 103 c. In some embodiments, the first conductive member 103 a is disposed over the RDL 101 and electrically connected to the conductive traces (101 d and 101 e). In some embodiments, the first conductive member 103 a is disposed within or surrounded by the molding 102. In some embodiments, the first conductive member 103 a is electrically coupled with the land portion 10 d. In some embodiments, the first conductive member 103 a is directly contacted with the land portion 101 d. In some embodiments, the first conductive member 103 a is extended from the land portion 101 d. In some embodiments, the first conductive member 103 a is extended through the molding 102. In some embodiments, the first conductive member 103 a is a dummy conductive member. In some embodiments, the first conductive member 103 a is served as a testing terminal for testing the first die 104 or an interconnection of the conductive trace (101 d, 101 e). In some embodiments, the first conductive member 103 a is a via, a pillar, a post, a connector or the like. In some embodiments, the first conductive member 103 a is a through integrated fan out via (TIV) or through molding via (TMV).

In some embodiments, the second conductive member 103 b is disposed over the RDL 101 and electrically connected to the conductive traces (101 d and 101 e). In some embodiments, the second conductive member 103 b is disposed within or surrounded by the molding 102. In some embodiments, the second conductive member 103 b is electrically coupled with the land portion 101 d. In some embodiments, the second conductive member 103 b is directly contacted with the land portion 101 d. In some embodiments, the second conductive member 103 b is extended from the land portion 101 d. In some embodiments, the second conductive member 103 b is extended through the molding 102. In some embodiments, the first conductive member 103 a is disposed between the first die 104 and the second conductive member 103 b. In some embodiments, the second conductive member 103 b is a via, a pillar, a post, a connector or the like. In some embodiments, the second conductive member 103 b is a through integrated fan out via (TIV) or through molding via (TMV). In some embodiments, the second conductive member 103 b has similar configuration as the first conductive member 103 a.

In some embodiments, the third conductive member 103 c is disposed over or partially surrounded by the dielectric layer 101 a. In some embodiments, the third conductive member 103 c is partially surrounded by the molding 102. In some embodiments, the third conductive member 103 c is surrounded by the dielectric layer 101 a and the molding 102. In some embodiments, the third conductive member 103 c is electrically connected to the conductive traces (101 d and 101 e). In some embodiments, the third conductive member 103 c is electrically coupled with the land portion 101 d. In some embodiments, the third conductive member 103 c is extended from the molding 102 to the dielectric layer 101 a. In some embodiments, the third conductive member 103 c is a pad, a bond pad or the like.

In some embodiments, the third conductive member 103 c is extended between the land portion 101 d and the first conductive member 103 a or the second conductive member 103 b. In some embodiments, the third conductive member 103 c is disposed between the first conductive member 103 a and the land portion 101 d. In some embodiments, the first conductive member 103 a is electrically connected to the land portion 101 d through the third conductive ember 103 c. In some embodiments, the first conductive member 103 a is bonded with the land portion 101 d by the third conductive member 103 c. In some embodiments, the first conductive member 103 c is extended from the third conductive member 103 c.

In some embodiments, the first die 104 is disposed over the RDL 101. In some embodiments, the first die 104 is surrounded by the molding 102. In some embodiments, the first die 104 is fabricated with a predetermined functional circuit within the first die 104. In some embodiments, the first die 104 is singulated from a semiconductive wafer by a mechanical or laser blade. In some embodiments, the first die 104 comprises a variety of electrical circuits suitable for a particular application. In some embodiments, the electrical circuits include various devices such as transistors, capacitors, resistors, diodes and/or the like.

In some embodiments, the first die 104 comprises of any one of various known types of semiconductor devices such as memories (such as DRAM, SRAMS, flash memories, etc.), microprocessors, application-specific integrated circuits (ASICs), or the like. In some embodiments, the first die 104 is a logic device die, central computing unit (CPU) die, or the like. In some embodiments, the first die 104 is a system on chip (SOC) that integrates all electronic components into a single die. In some embodiments, the first die 104 is a die, a chip or a package. In some embodiments, the first die 104 has a top cross section (a cross section from the top view of the semiconductor structure 100 as shown in FIG. 1) in a quadrilateral, a rectangular or a square shape.

In some embodiments, the first die 104 includes a substrate which comprises semiconductive materials such as silicon. In some embodiments, the substrate of the first die 104 includes several circuitries and electrical components disposed thereon. In some embodiments, the substrate of the first die 104 is a silicon substrate. In some embodiments, the first die 104 includes a first surface 104 a and a second surface 104 b opposite to the first surface 104 a. In some embodiments, the first surface 104 a is a front side or active side of the first die 104. In some embodiments, the second surface 104 b is a back side or inactive side of the first die 104. In some embodiments, the second surface 104 b of the first die 104 is exposed from the molding 102. In some embodiments, the first die 104 includes a sidewall 104 f disposed between the first surface 104 a and the second surface 104 b. In some embodiments, the sidewall 104 f is vertically extended between the first surface 104 a and the second surface 104 b. In some embodiments, the sidewall 104 f is processed by singulation, die sawing, laser cutting or similar operations. In some embodiments, the sidewall 104 f has roughness caused by the singulation operations. In some embodiments, a roughness of the first surface 104 a or the second surface 104 b is substantially less than the roughness of the sidewall 104 f. In some embodiments, the first surface 104 a and the sidewall 104 f of the first die 104 are in contact with the molding 102.

In some embodiments, a first die pad 104 c is disposed over the first die 104. In some embodiments, the first die pad 104 c is disposed over or within the first surface 104 a of the first die 104. In some embodiments, the first die pad 104 c is electrically connected to a circuitry external to the first die 104, such that a circuitry of the first die 104 is electrically connected to the circuitry external to the first die 104 through the first die pad 104 c. In some embodiments, the first die pad 104 c is configured to electrically couple with a conductive structure. In some embodiments, the first die pad 104 c includes gold, silver, copper, nickel, tungsten, aluminum, palladium and/or alloys thereof.

In some embodiments, a first connector 104 d is disposed over and electrically connected with the conductive trace (101 d, 101 e). In some embodiments, the first connector 104 d is disposed between the first die 104 and the land portion 101 d. In some embodiments, the first connector 104 d is disposed between the first die 104 and the third conductive member 103 c. In some embodiments, the first connector 104 d is configured to electrically connect to a circuitry or a conductive structure. In some embodiments, the first die 104 is electrically connected to the land portion 101 d through the first connector 104 d. In some embodiments, the first connector 104 d includes conductive material such as includes solder, copper, nickel, gold or etc. In some embodiments, the first connector 104 d is a conductive bump, a solder ball, a ball grid array (BGA) ball, controlled collapse chip connection (C4) bump, microbump, a pillar, a post or the like. In some embodiments, the first connector 104 d is in a spherical, hemispherical or cylindrical shape.

In some embodiments, a first underfill material 104 e is disposed over the RDL 101 to surround the first connector 104 d and partially surround the first die 104. In some embodiments, the first underfill material 104 e is in contact with the second surface 104 b and the sidewall 104 f of the first die 104 and the first connector 104 d. In some embodiments, the first underfill material 104 e is an electrically insulated adhesive for securing a bonding between the first die 104 and the third conductive member 103 c. In some embodiments, the first underfill material 104 e includes epoxy resin, epoxy molding compounds or etc.

In some embodiments, the second die 105 is disposed over the first die 104. In some embodiments, the second die 105 is disposed over the RDL 101, the molding 102, the first conductive member 103 a or the second conductive member 103 b. In some embodiments, a dimension of the second die 105 is substantially greater than a dimension of the first die 104. In some embodiments, a width of the second die 105 is substantially greater than a width of the first die 104.

In some embodiments, the second die 105 is fabricated with a predetermined functional circuit within the second die 105. In some embodiments, the second die 105 comprises a variety of electrical circuits suitable for a particular application. In some embodiments, the electrical circuits include various devices such as transistors, capacitors, resistors, diodes and/or the like. In some embodiments, the second die 105 comprises of any one of various known types of semiconductor devices such as memories (such as DRAM, SRAMS, flash memories, etc.), microprocessors, application-specific integrated circuits (ASICs), central computing unit (CPU) or the like. In some embodiments, the second die 105 is a die, a chip or a package. In some embodiments, the second die 105 has a top cross section (a cross section from the top view of the semiconductor structure 100 as shown in FIG. 1) in a quadrilateral, a rectangular or a square shape.

In some embodiments, the second die 105 includes a substrate which comprises semiconductive materials such as silicon. In some embodiments, the substrate of the second die 105 includes several circuitries and electrical components disposed thereon. In some embodiments, the substrate of the second die 105 is a silicon substrate. In some embodiments, the second die 105 includes a third surface 105 a and a fourth surface 105 b opposite to the third surface 105 a. In some embodiments, the third surface 105 a is a front side or active side of the second die 105. In some embodiments, the fourth surface 105 b is a back side or inactive side of the second die 105.

In some embodiments, a second connector 105 c is disposed over and electrically connected to the second conductive member 103 b. In some embodiments, the second connector 105 c is disposed between the second die 105 and the second conductive member 103 b. In some embodiments, the second connector 105 c disposed over the first conductive member 103 a is absent. In some embodiments, the second connector 105 c is only disposed over the second conductive member 103 b. In some embodiments, the second connector 105 c is isolated from the first conductive member 103 a. In some embodiments, the second die 105 is electrically connected to the conductive trace (101 d, 101 e), the first die 104 or the second conductive member 103 b through the second connector 105 c. In some embodiments, the first conductive member 103 a is electrically isolated from the second die 105.

In some embodiments, the second connector 105 c includes conductive material such as includes solder, copper, nickel, gold or etc. In some embodiments, the second connector 105 c is a conductive bump, a solder ball, a ball grid array (BGA) ball, controlled collapse chip connection (C4) bump, microbump, a pillar, a post or the like. In some embodiments, the second connector 105 c is in a spherical, hemispherical or cylindrical shape.

In some embodiments, an second underfill material 106 is disposed between the second die 105 and the molding 102. In some embodiments, the second underfill material 106 surrounds the second connector 105 c. In some embodiments, the second underfill material 106 is in contact with an outer surface of the second connector 105 c. In some embodiments, the second underfill material 106 is disposed between the third surface 105 a and the molding 102. In some embodiments, the second underfill material 106 surrounds the third surface 105 a. In some embodiments, the second underfill material 106 is in contact with a sidewall of the second die 105. In some embodiments, the fourth surface 105 b of the second die 105 is exposed from the second underfill material 106. In some embodiments, a portion of the second underfill material 106 is disposed over or is in contact with the first conductive member 103 a. In some embodiments, the second underfill material 106 is an electrically insulated adhesive for securing a bonding between the second die 105 and the second conductive member 103 b. In some embodiments, the second underfill material 106 includes epoxy resin, epoxy molding compounds or etc.

In some embodiments, the conductive bump 107 is disposed over the RDL 101. In some embodiments, the conductive bump 107 is electrically connected to the conductive trace (101 d, 101 e), the first conductive member 103 a, the second conductive member 103 b, the third conductive member 103 c, the first die 104, the second connector 105 c or the second die 105. In some embodiments, the conductive bump 107 is bonded with the land portion 101 d disposed over the second side 101 c of the RDL 101. In some embodiments, the conductive bump 107 is configured to bond with a conductive structure. In some embodiments, the conductive bump 107 is configured to electrically connect to a printed circuit board (PCB). In some embodiments, the conductive bump 107 includes conductive material such as includes solder, copper, nickel, gold or etc. In some embodiments, the conductive bump 107 is a conductive bump, a solder ball, a ball grid array (BGA) ball, controlled collapse chip connection (C4) bump, microbump, a pillar, a post or the like. In some embodiments, the conductive bump 107 is in a spherical, hemispherical or cylindrical shape.

FIG. 2 is a schematic cross sectional view of a semiconductor structure 200 in accordance with various embodiments of the present disclosure. In some embodiments, the semiconductor structure 200 includes a RDL 101, a first die 104, a second die 105 and a conductive bump 107, which have similar configuration as those described above or illustrated in FIG. 1.

In some embodiments, the RDL 101 includes a dielectric layer 101 a, a land portion 101 d and a via portion 101 e, which have similar configuration as those described above or illustrated in FIG. 1. In some embodiments, the first die 104 is disposed over the RDL 101 and electrically connected to the land portion 101 d, the via portion 101 e or the conductive bump 107 through a first connector 104 d. In some embodiments, the first connector 104 d has similar configuration as the one described above or illustrated in FIG. 1.

In some embodiments, a third conductive member (103 c-1, 103 c-2) is disposed over or electrically coupled with the land portion 101 d of the RDL 101. In some embodiments, the third conductive member 103 c is a pad, a bond pad or the like. In some embodiments, the third conductive member 103 c is partially disposed over the dielectric layer 101 a and partially surrounded by the dielectric layer 101 a. In some embodiments, In some embodiments, the third conductive member (103 c-1, 103 c-2) includes conductive material such as gold, silver, copper, nickel, tungsten, aluminum, palladium and/or alloys thereof.

In some embodiments, an second underfill material 106 is disposed over the RDL 101. In some embodiments, the second underfill material 106 is disposed over the dielectric layer 101 a. In some embodiments, the second underfill material 106 surrounds the first die 104. In some embodiments, the second underfill material 106 covers or surrounds the third conductive member 103 c-1. In some embodiments, a top surface or a side surface of the third conductive member 103 c-1 is in contact with the second underfill material 106. In some embodiments, the third conductive member 103 c-1 is a dummy pad. In some embodiments, the third conductive member 103 c-1 is served as a testing terminal for testing the first die 104, the land portion 101 d or the via portion 101 e.

In some embodiments, the first connector 104 d is surrounded by the second underfill material 106. In some embodiments, the first surface 104 a, the second surface 104 b and the sidewall 104 f of the first die 104 are in contact with the second underfill material 106. In some embodiments, the first connector 104 d is in contact with the second underfill material 106. In some embodiments, the second underfill material 106 includes epoxy resin, epoxy molding compounds or etc.

In some embodiments, the second die 105 is disposed over the RDL 101, the first die 104 and the second underfill material 106. In some embodiments, the second die 105 is electrically connected to the first die 104, the land portion 101 d, the via portion 101 e or the conductive bump 107 through a second connector 105 c. In some embodiments, the second die 105 has similar configuration as the one described above or illustrated in FIG. 1.

In some embodiments, the second underfill material 106 surrounds the second connector 105 c. In some embodiments, the second connector 105 c is disposed over the third conductive member 103 c-2. In some embodiments, the third conductive member 103 c-1 is electrically isolated from the second die 105. In some embodiments, the second connector 105 c disposed over the third conductive member 103 c-1 is absent. In some embodiments, the second connector 105 c is only disposed over the third conductive member 103 c-2. In some embodiments, the second underfill material 106 is an electrically insulated adhesive for securing a bonding between the second die 105 and the third conductive member 103 c-2. In some embodiments, the second connector 105 c includes conductive material such as includes solder, copper, nickel, gold or etc. In some embodiments, the second connector 105 c is a conductive bump, a solder ball, a ball grid array (BGA) ball, controlled collapse chip connection (C4) bump, microbump, a pillar, a post or the like. In some embodiments, the second connector 105 c is in a spherical, hemispherical or cylindrical shape.

In some embodiments, the second underfill material 106 is in contact with an outer surface of the second connector 105 c. In some embodiments, the second underfill material 106 is disposed between the third surface 105 a and the dielectric layer 101 a. In some embodiments, the second underfill material 106 surrounds the third surface 105 a. In some embodiments, the second underfill material 106 is in contact with a sidewall of the second die 105. In some embodiments, a portion of the second underfill material 106 is disposed over or is in contact with the third conductive member 103 c-1. In some embodiments, the second underfill material 106 includes epoxy resin, epoxy molding compounds or etc.

FIG. 3 is a schematic cross sectional view of a semiconductor structure 300 in accordance with various embodiments of the present disclosure. In some embodiments, the semiconductor structure 300 includes a first RDL 101, a first molding 102, a first conductive member 103 a, a second conductive member 103 b, a third conductive member 103 c, a first die 104, a second underfill material 106 and a first conductive bump 107, which have similar configuration as those described above or illustrated in FIG. 1 or 2.

In some embodiments, a third connector 108 is disposed over the second conductive member 103 b. In some embodiments, the third connector 108 is surrounded by the second underfill material 106. In some embodiments, a third connector 108 is disposed over and electrically connected to the second conductive member 103 b. In some embodiments, the third connector 108 disposed over the first conductive member 103 a is absent. In some embodiments, the third connector 108 is only disposed over the second conductive member 103 b. In some embodiments, the third connector 108 is isolated from the first conductive member 103 a. In some embodiments, the third connector 108 includes conductive material such as includes solder, copper, nickel, gold or etc. In some embodiments, the third connector 108 is a conductive bump, a solder ball, a ball grid array (BGA) ball, controlled collapse chip connection (C4) bump, microbump, a pillar, a post or the like. In some embodiments, the third connector 108 is in a spherical, hemispherical or cylindrical shape.

In some embodiments, a second RDL 110 is disposed over the underfill 106, the molding 102 and the first RDL 101. In some embodiments, the second RDL 110 includes a second dielectric layer 110 a, a second land portion 110 d and a second via portion 110 e. In some embodiments, the second RDL 110, the second dielectric layer 110 a, the second land portion 110 d and the second via portion 110 e have similar configuration as the first RDL 101, the first dielectric layer 101 a, the first land portion 101 d and the first via portion 101 e respectively described above or illustrated in FIG. 1 or 2.

In some embodiments, a second molding 112 is disposed over the second RDL 110. In some embodiments, the second molding 112 has similar configuration as the first molding 102 described above or illustrated in FIG. 1 or 2.

In some embodiments, a fourth conductive member 113 a and a fifth conductive member 113 b are extended through the second molding 112. In some embodiments, a sixth conductive member (113 c-1, 113 c-2) is extended from the second molding 112 to the second dielectric layer 110 a. In some embodiments, the fourth conductive member 113 a, the fifth conductive member 113 b and the sixth conductive member (113 c-1, 113 c-2) have similar configuration as the first conductive member 103 a, the second conductive member 103 b and the third conductive member (103 c-1, 103 c-2) respectively described above or illustrated in FIG. 1 or 2. In some embodiments, the sixth conductive member 113 c-1 is covered by the second molding 112. In some embodiments, a top surface of the sixth conductive member 113 c-1 is in contact with the second molding 112.

In some embodiments, a third die 114 is disposed over the second RDL 110. In some embodiments, the third die 114 is surrounded by the second molding 112. In some embodiments, the third die 114 is electrically connected to the first land portion 101 d or the first via portion 101 e through a fourth connector 114 d. In some embodiments, a fourth underfill material 114 e is disposed between the third die 114 and the second RDL 110 to surround the fourth connector 14 d. In some embodiments, the third die 114, the fourth connector 114 d and the fourth underfill material 114 e have similar configuration as the first die 104, the first connector 104 d and the first underfill material 104 e respectively described above or illustrated in FIG. 1 or 2.

In some embodiments, a second die 105 is disposed over the second molding 112, and a second connector 105 c is disposed over the fifth conductive member 113 b to electrically connect the second die 105 to the fifth conductive member 113 b through the second connector 105 c. In some embodiments, the second die 105 and the second connector 105 c have similar configuration as described above or illustrated in FIG. 1 or 2. In some embodiments, the second connector 105 c disposed over the fourth conductive member 113 a is absent. In some embodiments, the fourth conductive member 113 a is electrically isolated from the second die 105. In some embodiments, the second connector 105 c is only disposed over the fifth conductive member 113 b.

In some embodiments, a third underfill material 116 is disposed between the second die 105 and the second molding 112. In some embodiments, the third underfill material 116 surrounds the second connector 105 c. In some embodiments, the third underfill material 116 is disposed over or is in contact with the fourth conductive member 113 a. In some embodiments, the third underfill material 116 has similar configuration as the second underfill material 106 described above or illustrated in FIG. 1 or 2.

FIG. 4 is a schematic cross sectional view of a semiconductor structure 400 in accordance with various embodiments of the present disclosure. In some embodiments, the semiconductor structure 400 includes a first RDL 101, a first molding 102, a first conductive member 103 a, a second conductive member 103 b, a third conductive member 103 c, a first die 104, a first conductive bump 107, a second RDL 110, a third die 114 and a sixth conductive member (113 c-1, 113 c-2), which have similar configuration as those described above or illustrated in any one of FIGS. 1-3.

In some embodiments, the second RDL 110 is disposed over the second molding 102. In some embodiments, the third die 114 is disposed over the second RDL 1110. In some embodiments, the third die 114 is surrounded by the underfill material 106. In some embodiments, a third surface 114 a and a fourth surface 114 b of the third die 114 are in contact with the underfill material 106. In some embodiments, a second connector 105 c is disposed over the sixth conductive member 113 c-2. In some embodiments, the second connector 105 c disposed over the sixth conductive member 113 c-1 is absent. In some embodiments, the second die 105 is electrically connected to the second land portion 110 d through the second connector 105 c. In some embodiments, the sixth conductive member 113 c-1 is electrically isolated from the second die 105. In some embodiments, the sixth conductive member 113 c-1 is covered by the underfill material 106. In some embodiments, a top surface of the sixth conductive member 113 c-1 is in contact with the underfill material 106.

FIGS. 5-8 are schematic cross sectional views of a semiconductor structure (100, 200, 300, 400) along AA′, BB′, CC′ or DD′ in FIGS. 1-4, showing various arrangements of conductive members (103 a, 103 b, 103 c-1, 103 c-2, 113 a, 113 b, 113 c-1, 113 c-2). In some embodiments as shown in FIG. 5, the first conductive member 103 a, the third conductive member 103 c-1, the fourth conductive member 113 a or the sixth conductive member 113 c-1 is arranged proximal to a periphery of the semiconductor structure (100, 200, 300, 400). In some embodiments as shown in FIG. 6, the first conductive member 103 a, the third conductive member 103 c-1, the fourth conductive member 113 a or the sixth conductive member 113 c-1 is arranged at or near a corner of the semiconductor structure (100, 200, 300, 400).

In some embodiments as shown in FIG. 7, the first conductive member 103 a, the third conductive member 103 c-1, the fourth conductive member 113 a or the sixth conductive member 113 c-1 is arranged proximal to the first die 104 or the third die 114. In some embodiments, the first conductive member 103 a, the third conductive member 103 c-1, the fourth conductive member 113 a or the sixth conductive member 113 c-1 surrounds the first die 104 or the third die 114. In some embodiments as shown in FIG. 8, the first conductive member 103 a, the third conductive member 103 c-1, the fourth conductive member 113 a or the sixth conductive member 113 c-1 is arranged in staggered or random manner.

In the present disclosure, a method of manufacturing a semiconductor structure (100, 300, 400) is also disclosed. In some embodiments, a semiconductor structure (100, 300, 400) is formed by a method 500. The method 500 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations. FIG. 9 is an embodiment of the method 500 of manufacturing the semiconductor structure (100, 300, 400). The method 500 includes a number of operations (501, 502, 503, 504, 505, 506).

In operation 501, a redistribution layer (RDL) 101 is formed as shown in FIG. 9A. In some embodiments, a carrier 109 is provided, and the RDL 101 is formed over the carrier 109. In some embodiments, a carrier 109 is provided for temporarily supporting components subsequently disposed thereon. In some embodiments, the carrier 109 is a substrate or a wafer. In some embodiments, the carrier 109 includes silicon, glass, ceramic or the like.

In some embodiments, the RDL 101 is formed by disposing a dielectric layer 101 a over the carrier 109, removing some portions of the dielectric layer 101 a to form some recesses, and disposing a conductive material into the recesses to form conductive trace (land portion 101 d, via portion 101 e) within the dielectric layer 101 a and a third conductive member 103 c partially within the dielectric layer 101 a. In some embodiments, the third conductive member 103 c is a conductive pad. In some embodiments, the RDL 101, the dielectric layer 101 a, the land portion 101 d and the via portion 101 e have similar configuration as those described above or illustrated in FIG. 1 or 3.

In some embodiments, the dielectric layer 101 a is disposed by spin coating, chemical vapor deposition (CVD) or any other suitable operations. In some embodiments, the portions of the dielectric layer 101 a are removed by photolithography, etching or any other suitable operations. In some embodiments, the conductive material is disposed by sputtering, electroplating or any other suitable operations.

In operation 502, a first conductive member 103 a and a second conductive member 103 b are formed over the RDL 101 as shown in FIG. 9B. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are formed over the third conductive member 103 c. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are extended from the third conductive member 103 c. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are electrically connected to the conductive trace (101 d, 101 e) in the RDL 101. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are conductive vias. In some embodiments, the first conductive member 103 a and the second conductive member 103 b have similar configuration as those described above or illustrated in FIG. 1 or 3.

In some embodiments, the first conductive member 103 a and the second conductive member 103 b are formed by disposing a photoresist over the RDL 101, removing some portions of the photoresist to form some recesses over the third conductive member 103 c, and disposing a conductive material over the third conductive member 103 c. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are formed by sputtering, electroplating or any other suitable operations. In some embodiments, the first conductive member 103 a and the second conductive member 103 b are formed separately or simultaneously.

In operation 503, a first electrical test is performed as shown in FIG. 9C. In some embodiments, the first electrical test is performed through the first conductive member 103 a. In some embodiments, the first conductive member 103 a is a dummy conductive member for testing. In some embodiments, the first conductive member 103 a or the second conductive member 103 b is exposed from the RDL 101 upon the performance of the first electrical test. In some embodiments, the first electrical test is configured to test an interconnection of the conductive trace (101 d, 101 e) in the RDL 101 or identify a failure of the conductive trace (101 d. 101 e) in the RDL 101 and problematic RDL 101 such as poor electrical interconnection, short circuit, crack, delamination, etc. As such, problematic RDL 101 or conductive trace (101 d, 101 e) can be identified immediately after the formation of the first conductive member 103 a or the second conductive member 103 b.

In some embodiments, the first electrical test is performed by electrically connecting a probe card 201 to the conductive trace (101 d, 101 e) in the RDL 101 through the first conductive member 103 a. In some embodiments, the probe card 201 is electrically connected to the first conductive member 103 a through a probe card terminal 201 c. In some embodiments, the probe card 201 includes a power supply 201 a and is embedded with a chip 201 b or a functional circuitry such as a memory, a dynamic random access memory (DRAM), a flash memory, a NAND flash memory or a serial peripheral interface (SPI) memory.

In operation 504, a first die 104 is disposed over the RDL 101 as shown in FIG. 9D. In some embodiments, the first electrical test (the operation 503) is performed prior to the disposing of the first die 104 (the operation 504). In some embodiments, the first die 104 is disposed over the third conductive member 103 c. In some embodiments, the first die 104 includes a first die pad 104 c disposed over or within a surface of the first die 104 and a first connector 104 d disposed over the first die pad 104 c and bonded with the third conductive member 103 c. In some embodiments, the first die 104 is surrounded by the first conductive member 103 a or the second conductive member 103 b. In some embodiments, the first conductive member 103 a or the second conductive member 103 b is electrically connected to the first die 104 through the conductive trace (101 d, 101 e). In some embodiments, a first underfill material 104 e is disposed between the RDL 101 and the first die 104 to surround the first die 104. In some embodiments, the first die 104 includes a sidewall 104 f disposed between a first surface 104 a and a second surface 104 b. In some embodiments, the sidewall 104 f is vertically extended between the first surface 104 a and the second surface 104 b. In some embodiments, the first die 104 is singulated from a wafer or substrate. In some embodiments, the first die 104 is formed by cutting the wafer along the sidewall 104 f. In some embodiments, the first die 104 is singulated by die sawing, laser cutting or any other suitable operations. In some embodiments, the sidewall 104 f has roughness after the singulation operations. In some embodiments, a roughness of the first surface 104 a or the second surface 104 b is substantially less than the roughness of the sidewall 104 f. In some embodiments, the first die 104, the first surface 104 a, the second surface 104 b, the first die pad 104 c, the first connector 104 d, the first underfill material 104 e and the sidewall 104 f have similar configuration as those described above or illustrated in FIG. 1 or 3.

In operation 505, a second electrical test is performed as shown in FIG. 9E. In some embodiments, the second electrical test is performed through the first conductive member 103 a. In some embodiments, the first conductive member 103 a, the second conductive member 103 b is exposed from the RDL 101 upon the performance of the second electrical test. In some embodiments, the first die 104 is exposed upon the performance of the second electrical test. In some embodiments, the first surface 104 a, the second surface 104 b or the sidewall 104 f of the first die 104 is exposed to the ambient environment upon the performance of the second electrical test. In some embodiments, the second surface 104 b and the sidewall 104 f of the first die 104 are exposed to the ambient environment upon the performance of the second electrical test. In some embodiments, the second electrical test is configured to test the first die 104 or identify problematic first die 104 such as failure of the first die 104, poor electrical interconnection in the first die 104, short circuit in the first die 104, etc. As such, problematic first die 104 can be identified immediately after the disposing of the first die 104.

In some embodiments, the second electrical test is performed by electrically connecting the probe card 201 to the first die 104 through the first conductive member 103 a. In some embodiments, the probe card 201 is electrically connected to the first die 104 through a probe card terminal 201 c. In some embodiments, the probe card 201 includes the power supply 201 a and is embedded with the chip 201 b or a functional circuitry such as a memory, a dynamic random access memory (DRAM), a flash memory, a NAND flash memory or a serial peripheral interface (SPI) memory.

In some embodiments, a molding 102 is formed as shown in FIG. 9F. In some embodiments, the molding 102 is formed after the performance of the first electrical test (the operation 503) or the performance of the second electrical test (the operation 504). In some embodiments, the molding 102 is formed by transfer molding, injection molding or any other suitable operations. In some embodiments, the molding 102 is disposed over the RDL 101. In some embodiments, the molding 102 surrounds the first die 104, the first conductive member 103 a and the second conductive member 103 b. In some embodiments, the third conductive member 103 c is partially surrounded by the molding 102. In some embodiments, the molding 102 is in contact with the second surface 104 b and the sidewall 104 f of the first die 104, an outer surface of the first conductive member 103 a and an outer surface of the second conductive member 103 b. In some embodiments, the molding 102 has similar configuration as the one described above or illustrated in FIG. 1 or 3.

In operation 506, a second die 105 is disposed over the first die 104 as shown in FIG. 9G. In some embodiments, the second die 105 is disposed over the first conductive member 103 a or the second conductive member 103 b. In some embodiments, the second electrical test (the operation 505) is performed prior to the disposing of the second die 105. In some embodiments, the second die 105 includes a second connector 105 c disposed over the second conductive member 103 b. In some embodiments, the second connector 105 c is electrically connected to the second conductive member 103 b. In some embodiments, the second die 105 is electrically connected to the conductive trace (101 d, 101 e) through the second connector 105 c and the second conductive member 103 b. In some embodiments, the second connector 105 c is only disposed over or electrically connected to the second conductive member 103 b. In some embodiments, the first conductive member 103 a is electrically isolated from the second die 105 or the second connector 105 c. In some embodiments, the first conductive member 103 a is isolated from the second die 105 or the second connector 105 c. In some embodiments, the second connector 105 c disposed over the first conductive member 103 a is absent. In some embodiments, the second die 105 has similar configuration as the one described above or illustrated in FIG. 1 or 3.

In some embodiments, an second underfill material 106 is disposed between the second die 105 and the molding 102 as shown in FIG. 9H. In some embodiments, the second underfill material 106 is disposed over the first die 104, the first conductive member 103 and the second conductive member 103 b. In some embodiments, the second die 105 is partially surrounded by the second underfill material 106. In some embodiments, a fourth surface 105 b and a sidewall of the second die 105 are in contact with the second underfill material 106. In some embodiments, a third surface 105 a of the second die 105 is exposed from the second underfill material 106. In some embodiments, a portion of the second underfill material 106 is in contact with the first conductive member 103 a. In some embodiments, the first conductive member 103 a is covered by the second underfill material 106. In some embodiments, the second underfill material 106 is disposed by injection, flowing or any other suitable operations. In some embodiments, the second underfill material 106 has similar configuration as the one described above or illustrated in FIG. 1 or 3.

In some embodiments, the carrier 109 is removed as shown in FIG. 9I. In some embodiments, the carrier 109 is removed after the disposing of the second die 105 or the disposing of the second underfill material 106. In some embodiments, the carrier 109 is debonded from the RDL 101 or the dielectric layer 101 a.

In some embodiments, a conductive bump 107 is disposed over the RDL 101 as shown in FIG. 9J. In some embodiments, the first electrical test (the operation 503) and the second electrical test (the operation 505) are performed prior to the disposing of the conductive bump 107. In some embodiments, the conductive bump 107 is disposed over a second side 101 c of the RDL 101. In some embodiments, the conductive bump 107 is disposed over the land portion 101 d. In some embodiments, the conductive bump 107 is electrically connected to the conductive trace (101 d, 101 e), the first die 104, the first conductive member 103 a, the second conductive member 103 b, the third conductive member 103 c or the second die 105. In some embodiments, the conductive bump 107 is disposed by ball dropping, solder pasting, stencil printing or other suitable operations. In some embodiments, the conductive bump 107 has similar configuration as the one described above or illustrated in FIG. 1 or 3. In some embodiments, a semiconductor structure 100 is formed which has similar configuration as the one in FIG. 1.

In the present disclosure, a method of manufacturing a semiconductor structure (200, 300, 400) is also disclosed. In some embodiments, a semiconductor structure (200, 300, 400) is formed by a method 600. The method 600 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations. FIG. 10 is an embodiment of the method 600 of manufacturing the semiconductor structure (200, 300, 400). The method 600 includes a number of operations (601, 602, 603, 604, 605).

In operation 601, a RDL 101 is formed as shown in FIG. 10A. In some embodiments, a third conductive member (103 c-1, 103 c-2) is formed over a dielectric layer 101 a of the RDL 101. In some embodiments, the third conductive member (103 c-1, 103 c-2) is a conductive pad disposed over the RDL 101. In some embodiments, the operation 601 is similar to the operation 501 as shown in FIG. 9A.

In operation 602, a first electrical test is performed as shown in FIG. 10B. In some embodiments, the first electrical test is performed through the third conductive member 103 c-1. In some embodiments, the third conductive member 103 c-1 is a dummy conductive member for testing. In some embodiments, the third conductive member (103 c-1, 103 c-2) is exposed from the RDL 101 upon the performance of the first electrical test. In some embodiments, the first electrical test is configured to test an interconnection of the conductive trace (101 d, 101 e) in the RDL 101 or identify a failure of the conductive trace (101 d, 101 e) in the RDL 101 and problematic RDL 101 such as poor electrical interconnection, short circuit, crack, delamination, etc. As such, problematic RDL 101 or conductive trace (101 d, 101 e) can be identified immediately after the formation of the third conductive member (103 c-1, 103 c-2).

In some embodiments, the first electrical test is performed by electrically connecting a probe card 201 to the conductive trace (101 d, 101 e) in the RDL 101 through the third conductive member 103 c-1. In some embodiments, the probe card 201 is electrically connected to the third conductive member 103 c-1 through a probe card terminal 201 c. In some embodiments, the probe card 201 includes a power supply 201 a and is embedded with a chip 201 b or a functional circuitry such as a memory, a dynamic random access memory (DRAM), a flash memory, a NAND flash memory or a serial peripheral interface (SPI) memory.

In operation 603, a first die 104 is disposed over the RDL 101 as shown in FIG. 10C. In some embodiments, the operation 603 is similar to the operation 504 as shown in FIG. 9D.

In operation 604, a second electrical test is performed as shown in FIG. 10D. In some embodiments, the second electrical test is performed through the third conductive member 103 c-1. In some embodiments, the third conductive member (103 c-1, 103 c-2) is exposed from the RDL 101 upon the performance of the second electrical test. In some embodiments, the first die 104 is exposed upon the performance of the second electrical test. In some embodiments, a first surface 104 a, a second surface 104 b or a sidewall 104 f of the first die 104 is exposed to the ambient environment upon the performance of the second electrical test. In some embodiments, the second surface 104 b and the sidewall 104 f of the first die 104 are exposed to the ambient environment upon the performance of the second electrical test. In some embodiments, the second electrical test is configured to test the first die 104 or identify problematic first die 104 such as failure of the first die 104, poor electrical interconnection in the first die 104, short circuit in the first die 104, etc. As such, problematic first die 104 can be identified immediately after the disposing of the first die 104.

In some embodiments, the second electrical test is performed by electrically connecting the probe card 201 to the first die 104 through the third conductive member 103 c-1. In some embodiments, the probe card 201 is electrically connected to the first die 104 through a probe card terminal 201 c. In some embodiments, the probe card 201 includes the power supply 201 a and is embedded with the chip 201 b or a functional circuitry such as a memory, a dynamic random access memory (DRAM), a flash memory, a NAND flash memory or a serial peripheral interface (SPI) memory.

In operation 605, a second die 105 is disposed as shown in FIG. 0E. In some embodiments, the second die 105 is disposed over the third conductive member 103 c-2. In some embodiments, the second electrical test (the operation 604) is performed prior to the disposing of the second die 105. In some embodiments, the second die 105 includes a second connector 105 c disposed over the third conductive member 103 c-2. In some embodiments, the second connector 105 c is electrically connected to the third conductive member 103 c-2. In some embodiments, the second die 105 is electrically connected to the conductive trace (101 d, 101 e) through the second connector 105 c and the third conductive member 103 c-2. In some embodiments, the second connector 105 c is only disposed over or electrically connected to the third conductive member 103 c-2. In some embodiments, the third conductive member 103 c-1 is electrically isolated from the second die 105 or the second connector 105 c. In some embodiments, the third conductive member 103 c-l is isolated from the second die 105 or the second connector 105 c. In some embodiments, the second connector 105 c disposed over the third conductive member 103 c-1 is absent.

In some embodiments, an second underfill material 106 is disposed between the second die 105 and the molding 102 as shown in FIG. 10F. In some embodiments, the second underfill material 106 is disposed between the second die 105 and the RDL 101. In some embodiments, the second underfill material 106 surrounds the second connector 105 c and the first die 104. In some embodiments, the second die 105 is partially surrounded by the second underfill material 106. In some embodiments, the second underfill material 106 is in contact with a fourth surface 105 b of the second die 105, a sidewall of the second die 105, the first surface 104 a of the first die 104, the second surface 104 b of the first die 104 and the sidewall 104 f of the first die 104. In some embodiments, the third conductive member 103 c is covered or surrounded by the second underfill material 106. In some embodiments, the second underfill material 106 has similar configuration as the one described above or illustrated in FIG. 2 or 4.

In some embodiments, the carrier 109 is removed as shown in FIG. 10G. In some embodiments, the carrier 109 is removed after the disposing of the second die 105 or the disposing of the second underfill material 106. In some embodiments, the carrier 109 is debonded from the RDL 101 or the dielectric layer 101 a.

In some embodiments, a conductive bump 107 is disposed over the RDL 101 as shown in FIG. 10H. In some embodiments, the first electrical test (the operation 602) and the second electrical test (the operation 604) are performed prior to the disposing of the conductive bump 107. In some embodiments, the conductive bump 107 is disposed over a second side 101 c of the RDL 101. In some embodiments, the conductive bump 107 is disposed over the land portion 101 d. In some embodiments, the conductive bump 107 is electrically connected to the conductive trace (10 d, 101 e), the first die 104, the third conductive member 103 c or the second die 105. In some embodiments, the conductive bump 107 is disposed by ball dropping, solder pasting, stencil printing or other suitable operations. In some embodiments, the conductive bump 107 has similar configuration as the one described above or illustrated in FIG. 2 or 4. In some embodiments, a semiconductor structure 200 is formed which has similar configuration as the one in FIG. 2.

In the present disclosure, a semiconductor structure is disclosed. The semiconductor structure includes a dummy conductive member for electrical testing during the manufacturing of the semiconductor structure. A die or an electrical interconnection in the semiconductor structure can be tested through the dummy conductive member during the manufacturing. As such, failure of die or problematic electrical interconnection can be identified before the completion of the semiconductor structure. Therefore, wastage of material can be minimized and a yield of the semiconductor structure can be increased or improved.

In some embodiments, a method of manufacturing a semiconductor structure includes forming a redistribution layer (RDL); forming a conductive pad over the RDL; performing a first electrical test through the conductive pad; bonding a first die over the RDL by a connector; disposing a first underfill material to surround the connector; performing a second electrical test through the conductive pad; disposing a second die over the first die and the conductive pad; and disposing a second underfill material to surround the second die, wherein the conductive pad is at least partially in contact with the second underfill material, and is protruded from the RDL during the first electrical test and the second electrical test.

In some embodiments, the first electrical test is performed prior to the disposing of the first die and the disposing of the second die. In some embodiments, the second electrical test is performed after the disposing of the first die and prior to the disposing of the second die. In some embodiments, the conductive pad is exposed from the RDL upon the performance of the first electrical test and the performance of the second electrical test. In some embodiments, the conductive pad is exposed from the RDL after the disposing of the second die and prior to the disposing of the second underfill material. In some embodiments, the conductive pad is electrically connected to the first die. In some embodiments, the conductive pad is electrically isolated from the second die. In some embodiments, the first electrical test and the second electrical test are performed through a surface of the conductive pad, and the surface is in contact with the second underfill material.

In some embodiments, a method of manufacturing a semiconductor structure includes forming a redistribution layer (RDL); forming a first conductive pad over the RDL; forming a second conductive pad over the RDL; performing a first electrical test through the first conductive pad; bonding a first die over the first RDL by a first connector; disposing a first underfill material to surround the first connector; performing a second electrical test through the first conductive pad; and bonding a second die over the first die and the RDL by a second connector; wherein the first conductive pad is electrically isolated from the second die, the second conductive pad is electrically connect the second die, the first conductive pad and the second conductive pad are protruded from the RDL during the first electrical test and the second electrical test.

In some embodiments, the first electrical test includes electrically connecting a probe card to the RDL through the first conductive pad. In some embodiments, the second electrical test includes electrically connecting the probe card to the first die through the first conductive pad. In some embodiments, the first conductive pad is exposed from the RDL after the disposing of the second die. In some embodiments, the second conductive pad is covered by the second connector after the disposing of the second die. In some embodiments, the method further includes disposing a second underfill material to surround the second connector. In some embodiments, the second conductive pad is in contact with the second connector and the second underfill material. In some embodiments, the first die and the first underfill material are surrounded by the second underfill material. In some embodiments, the first conductive pad and the second conductive pad are formed separately or simultaneously.

In some embodiments, a method of manufacturing a semiconductor structure includes forming a redistribution layer (RDL); forming a first conductive pad over the RDL; forming a second conductive pad over the RDL; performing a first electrical test through the first conductive pad; bonding a first die over the RDL by a first connector; disposing a first underfill material to surround the first connector; performing a second electrical test through the first conductive pad; bonding a second die over the first die and the RDL by a second connector; and disposing a second underfill material to surround the second die, wherein a top surface of the first conductive pad is in contact with the second underfill material, and a top surface of the second conductive pad is in contact with the second connector.

In some embodiments, the first electrical test and the second electrical test are performed through the top surface of the first conductive pad. In some embodiments, the top surface of the first conductive pad is substantially coplanar with the top surface of the second conductive pad.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

1. A method of manufacturing a semiconductor structure, comprising: forming a redistribution layer (RDL); forming a conductive pad over the RDL; performing a first electrical test through the conductive pad; bonding a first die over the RDL by a connector; disposing a first underfill material to surround the connector; performing a second electrical test through the conductive pad; disposing a second die over the first die and the conductive pad; and disposing a second underfill material to surround the second die, wherein the conductive pad is at least partially in contact with the second underfill material, and is protruded from the RDL during the first electrical test and the second electrical test.
 2. The method of claim 1, wherein the first electrical test is performed prior to the disposing of the first die and the disposing of the second die.
 3. The method of claim 1, wherein the second electrical test is performed after the disposing of the first die and prior to the disposing of the second die.
 4. The method of claim 1, wherein the conductive pad is exposed from the RDL upon the performance of the first electrical test and the performance of the second electrical test.
 5. The method of claim 1, wherein the conductive pad is exposed from the RDL after the disposing of the second die and prior to the disposing of the second underfill material.
 6. The method of claim 1, wherein the conductive pad is electrically connected to the first die.
 7. The method of claim 1, wherein the conductive pad is electrically isolated from the second die.
 8. The method of claim 1, wherein the first electrical test and the second electrical test are performed through a surface of the conductive pad, and the surface is in contact with the second underfill material.
 9. A method of manufacturing a semiconductor structure, comprising: forming a redistribution layer (RDL); forming a first conductive pad over the RDL; forming a second conductive pad over the RDL; performing a first electrical test through the first conductive pad; bonding a first die over the first RDL by a first connector; disposing a first underfill material to surround the first connector; performing a second electrical test through the first conductive pad; and bonding a second die over the first die and the RDL by a second connector; wherein the first conductive pad is electrically isolated from the second die, the second conductive pad is electrically connect the second die, the first conductive pad and the second conductive pad are protruded from the RDL during the first electrical test and the second electrical test.
 10. The method of claim 9, wherein the first electrical test includes electrically connecting a probe card to the RDL through the first conductive pad.
 11. The method of claim 9, wherein the second electrical test includes electrically connecting the probe card to the first die through the first conductive pad.
 12. The method of claim 9, wherein the first conductive pad is exposed from the RDL after the disposing of the second die.
 13. The method of claim 9, wherein the second conductive pad is covered by the second connector after the disposing of the second die.
 14. The method of claim 9, further comprising disposing a second underfill material to surround the second connector.
 15. The method of claim 14, wherein the second conductive pad is in contact with the second connector and the second underfill material.
 16. The method of claim 14, wherein the first die and the first underfill material are surrounded by the second underfill material.
 17. The method of claim 9, wherein the first conductive pad and the second conductive pad are formed separately or simultaneously.
 18. A method of manufacturing a semiconductor structure, comprising: forming a redistribution layer (RDL); forming a first conductive pad over the RDL; forming a second conductive pad over the RDL; performing a first electrical test through the first conductive pad; bonding a first die over the RDL by a first connector; disposing a first underfill material to surround the first connector; performing a second electrical test through the first conductive pad; bonding a second die over the first die and the RDL by a second connector; and disposing a second underfill material to surround the second die, wherein a top surface of the first conductive pad is in contact with the second underfill material, and a top surface of the second conductive pad is in contact with the second connector.
 19. The method of claim 18, wherein the first electrical test and the second electrical test are performed through the top surface of the first conductive pad.
 20. The method of claim 18, wherein the top surface of the first conductive pad is substantially coplanar with the top surface of the second conductive pad. 